镀金服务

镀金服务per MIL-G-45204, ASTM B488, AMS 2422

电子游艺棋牌先进的电镀技术是一个行业领先的公司领先的公司，该公司是MIL-G-45204，ASTM B488或AMS 2422。我们在提供精密桶，机架和振动镀金的六十年内专业知识目前在包括医疗的许多行业中使用，电信，航空航天和电子工业。

恰当的提供了一个完整的范围的镀金、档次es including Type I, II and III purity deposits in both soft and hard gold formulations. Advanced Plating Technologies has the ability to underplate with our various镀镍服务包括两者bright electrolytic nickel,sulfamate electrolytic nickel和electroless nickeldeposits as well as镀铜要么silver platingif required.

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镀金服务– Gold Deposit Properties

Gold plating has excellent electrical and thermal conductivity, offers exceptional solderability and is a superb reflector of infrared radiation. In addition, gold is a noble metal that does not oxidize or chemically react under normal conditions. For this reason gold plating it is an exceptional choice for numerous engineering requirements where electrical conductivity (especially at low voltages), solderability and corrosion resistance are design requirements.

Advanced Plating Technologies, a Milwaukee, Wisconsin company, offers gold plating in both 99.7% pure “hard” gold and 99.9% pure soft gold electrodeposits. Hard gold plating services are commonly employed in applications where repeated sliding or connection wear is a design consideration, such as in female to male interconnect pins or sprung contacts. Our company offers hard gold electroplating that is alloyed with a small amount of cobalt to achieve the required deposit properties.

Soft gold plating is commonly used where the highest of gold purity is required for soldering, wire bonding, high temperature or high corrosion resistance applications. The soft layer of gold plating deposit provides an extremely pure deposit of gold, which maintains the low hardness, and high corrosion resistance of gold consistent with its elemental form. Soft gold plating is preferred for high temperature applications due to the fact that alloying elements of hard gold plating can oxidize at elevated temperatures.

金镀的外观非常多于施加最终金层之前施加的底板的功能。如果是哑光镍，如sulfamate nickelis applied, the final gold deposit will have more of a matte appearance. If a brightened nickel such as brightelectrolytic nickelis utilized, the gold plating will have a bright appearance. As with any deposit, the luster of the basis material has a large degree of correlation to the luster of the final gold plating.

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镀金服务– Advanced Plating Technologies’ Capabilities

Specifications:
MIL-G-45204
ASTM B488.
AMS 2422
Most Company Specific Specifications

纯度：
Soft Gold up to 99.9% Pure
Hard Gold up to 99.7% Pure

Finish Type:
Hard (Code B or C per ASTM B488 or Mil-G-45204)
软(代码/ ASTM B488或mil - g - 45204)

Substrates Plated On:
Ferrous:All Ferrous Alloys Including Mild Steel, Stainless Steels, Hardened Steels & Tool Steels
Cuprous:All Cuprous Alloys Including Pure Copper, Copper Alloys Including Tellurium & Beryllium, Brass, Nickel-Silver
Aluminum:All Aluminum Alloys Including Wrought, Cast and Proprietary Alloys (MIC-6)
Exotics:Inconel, Pure Nickel (Nickel 200), Cobalt-Chrome (MP35N), Kovar, Monel, Hastalloy, Monel, Lead

Part Size Limitations:24 inches x 22 inches x 10 inches

提供的面板：
Bright Electrolytic Nickel
Sulfamate Electrolytic Nickel
Electroless Nickel (High or Medium Phosphorous)
铜
Silver

HeatTreatments:
Hydrogen Embrittlement Bakes
Stress Relieving Bakes
High Temperature Bakes up to 750F

方法：
Selective Loose Piece Plating
Sheet Product (Chemically Milled/Etched Sheets)
Segmented Strips (Frets)
桶
Rack
Wire
振动

Our gold electroplating services are for commercial, high volume applications. At this time we do not offer electroplating on custom applications such as a watch, jewelry, silverware, etc. Please visitRefinishing & Platingfor access to custom gold plating kits.

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镀金服务 - 镀金规格

The three most common gold plating services certified by Advanced Plating Technologies are MIL-G-45204, ASTM B488 and AMS 2422. Our company can provide Type I, II and III gold deposits per these industry standards. Gold plating services to AMS 2425 as well as most company-specific gold specifications can also be provided as detailed in ourspecification database. A summary of gold plating services to ASTM B488, MIL-G-45204 and AMS 2422 is provided below:

镀金服务to ASTM B488-01

Note:ASTM B488.underwent a major revision from 1995 to 2001. The Type callout of the ASTM was revised to parallel that of MIL-G-45204 such that the Type and Codes of the ASTM and MIL specs are synonymous. The Types listed below are per the current 2001 revision of ASTM B488.

I型：99.7% pure gold with a hardness ranging from A (90 HK₂₅max) to C (130-200 HK₂₅).
Type II:99.0% pure gold often referred to as hard gold with a hardness ranging from B (91-129 KH₂₅) to D (> 200 HK₂₅).
III型：99.9% pure gold often referred to as soft gold with a hardness of A only (90 HK₂₅Max).

Code A:90香港₂₅最大
Code B:91-129 HK₂₅
Code C:130-200 HK₂₅
Code D:> 200 HK₂₅

Relationship Between Purity and Hardness (ASTM B488-01 and Newer)
TypeCode
我，b和c
II B，C和D.
III A Only

Class最小厚度[um]
0.25 0.25
0.50 0.50
0.75 0.75
1.0 1.0
1.25 1.25
2.5 2.5
5 5.0

6.5.1镍底层- 对于除5.0之外的厚度等级，当产品由铜或铜合金制成时，应在金涂层之前施加镍外穿孔。镍外层也适用于其他原因（见附录X6）。

附录X6：使用镍底板的原因
X6.1 Diffusion Barrier (E.g. migration of zinc into the gold layer from a brass substrate)

X6.2 Leveling Layer (Brightening)
X6.3孔隙腐蚀抑制剂
X6.4 Tarnish Creepage Inhibitor for Gold
X6.5 Load-Bearing Underlayer for Contacting Surfaces

镀金服务to MIL-G-45204

I型 - 最低金币99.7％
Type II – 99.0 percent gold minimum
Type III – 99.9 percent gold minimum

Grade A – Knoop hardness 90 max
Grade B – Knoop hardness 91-129, incl.
级C - Knoop硬度130-200，包括
D级 - Knoop硬度201及其结束。

If the hardness grade for the gold coating is not specified, Type I shall be furnished at hardness Grade A (90 Knoop max) and Type II shall be furnished at hardness Grade C (130 to 200 Knoop)

纯度(Type) and hardness (grade) relationship:
纯度Hardness
Type I A, B or C
II型B，C或D.
只有III型A

Class 00 – 0.00002 inch thick, minimum
Class 0 – 0.00003 inch thick, minimum
Class 1 – 0.00005 inch thick, minimum
Class 2 – 0.00010 inch thick, minimum
Class 3 – 0.00020 inch thick, minimum
Class 4 – 0.00030 inch thick, minimum
Class 5 – 0.00050 inch thick, minimum
Class 6 – 0.00150 inch thick, minimum

Underplate Requirements per section 6.3:a copper, nickel, or copper plus nickel underplate may be used, depending on the application and the environment. Silver or copper plus silver may not be used unless required by item specification. A soft gold strike from a separate plating tank should follow any other undercoating and precede the final gold coating to improve adhesion and prevent contamination of the main gold plating solution by metallic impurities. When applied to a copper rich surface such as brass, bronze or beryllium copper or a copper plate or strike, an antidiffussion underplate such as nickel shall be applied.

镀金服务to AMS 2422

3.2.1 Copper Flash or Copper Strike: A copper flash or copper strike shall be electrodeposited from a suitable plating solution, except as exempted in 3.2.1.1.

3.2.1.1当镀铜的零件由含有小于15％锌的铜或铜合金制成时，可以省略铜闪光或铜击。

3.2.2镍闪光灯或镍冲击：镍闪光灯或镍击击应从铜，铜合金的合适镍电镀溶液电沉积，含有小于15％锌，铜闪光或铜击。

3.4.1.1 Copper Flash or Strike: Not less than 0.0001 inch (2.5um)

3.4.1.2 Nickel Strike: Not less than 0.0001 inch (2.5um)

3.4.1.3 Gold Plate: Note less than 0.00005 inch (1.27um) on all surfaces on which gold plating is specified.

3.4.4 Purity: Gold, as plated, shall be not less than 99.0% pure, determined by a method acceptable to purchaser.